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1.75MM PLA+3D FILAMENT GREY-1KG(N.W)..
11.000 OMR
1.High Grade Stability And Reliability.2.Apply to CPU, VGA, Chipset, Radiator And Other PC Components.3.Helps Disperse The Heat From CPU To Heatsink Effectively.4.Low Thermal Resistance And High Conductivity For Superior Heat Transfer.5.High Temperature Resistance. Non-toxic, Tasteless, Non-corrosiv..
1.500 OMR
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